Meijer Notebook Spécifications télécharger pdf (Page 83)

10.

Remove the fan/heat sink assembly (4) by lifting straight up.

Each time the fan/heat sink assembly is removed, the thermal material must be thoroughly cleaned from

the system board at locations (1) and (2), from the fan/heat sink assembly at locations (3) and (5),

and from the processor (4). Thermal pads and thermal paste must be installed on all surfaces before

the fan/heat sink assembly is reinstalled.

NOTE: Thermal pads and thermal paste are included with all fan/heat sink assembly, system board,

and processor spare part kits.

The following illustration shows the locations for thermal material on systems with Intel processors.

Each time the fan/heat sink assembly is removed, the thermal material must be thoroughly cleaned from

the system board at locations (1), (2), and (4), from the fan/heat sink assembly at locations (3), (5),

and (7), and from the processor (6). Thermal pads and thermal paste must be installed on all surfaces

before the fan/heat sink assembly is reinstalled.

The following illustration shows the locations for thermal material on systems with AMD processors.

Component replacement procedures

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Meijer Notebook Spécifications Page 83